From packaging to fast timing simulators
YazarGöknar, İzzet Cem
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KünyeGÖKNAR, İ.C. (2003). From packaging to fast timing simulators. IEEE International Symposium on Electromagnetic Compatibility, 2003. EMC '03. 2003. Volume 2, pp.1269-1272. http://dx.doi.org/10.1109/ICSMC2.2003.1429151
When considering all the steps from packaging to verification of the design one is faced with many challenges ranging from the choice of the proper tools to model the device/interconnect physics, to high level simulations at the timing level. This paper starts by reviewing some of the tools available for extraction of device/interconnect parameters from their structure and shows how they are put to use in high level simulators such as ILLIADS-I.